O2+ - implantation
for glass bonding

The today's microsystem technique requires bonding of different components made from different materials at one chip. Beside other techniques bonding (like wafer bonding) could be a solution. The following figure shows two oxygen implanted glass plates (20 keV, 5x1016cm-2 O2+) with their strong increased adhesion.

Demonstration of the adhesion of two oxygen implanted glass plates

N2+ -implantation in stainless steel         Nitrogen Plasma Immersion Ion Implantation (III)
        Implantation         Download

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