O2+ - implantation
for glass bonding
The today's microsystem technique requires bonding of different components made from different materials at one chip. Beside other techniques bonding (like wafer bonding) could be a solution. The following figure shows two oxygen implanted glass plates (20 keV, 5x1016cm-2 O2+) with their strong increased adhesion.
Demonstration of the adhesion of two oxygen implanted glass plates